Senior Thin Film Process Engineer (ECP) JR11356, Ang Mo Kio

About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be YOUR ROLE As a
Senior Process Engineer , you will be the technical owner of the
Electro‑Chemical Plating (ECP) copper process
on the
LAM Novellus SABRE platform . You will drive process development and sustaining activities, working closely with equipment engineering to characterize hardware, resolve complex issues, and continuously improve process robustness, yield, and overall tool performance. Develop, optimize, and sustain
ECP Cu reinforcement / damascene fill processes
on Novellus SABRE tools. Define and tune
recipes and hardware configurations
to achieve target thickness, uniformity, fill performance, and defect levels. Collaborate with
PVD barrier/seed
and integration teams to ensure strong linkage between upstream processes (Ti, TiN, CVD‑TiN, Cu seed, etc.) and downstream ECP performance. Perform structured
hardware and process characterization , including experiments on flow, contact design, waveform, and chemistry conditions. Lead
troubleshooting and excursion management , conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions. YOUR SKILLS & EXPERIENCES Bachelor's or Master's degree in
Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering , or a related discipline. Min 5 years of hands‑on experience
with
ECP copper processes on LAM Novellus SABRE systems
in a semiconductor fab environment. Solid knowledge of
semiconductor manufacturing ,
vacuum technology , and
thin‑film deposition , including PVD barrier/seed fundamentals. Strong
collaboration and communication
skills: able to document and present findings clearly through technical reports, reviews, and data summaries active participation in cross‑functional forums and project teams. Proven
problem‑solving capability , including advanced root‑cause analysis, failure‑mode identification, and implementation of robust, sustainable solutions.