Staff Process Engineer, Advanced Solutions (Die Attach / …, Singapore

Adecco is partnering with a global leader in semiconductor packaging and electronic assembly solutions, seeking a senior process engineer (DA/FC/TVB).

The process engineer works holistically as the key interface personnel between customer and multidisciplinary engineering teams, providing turnkey solution by maximizing the capability of the machine.

• Test, troubleshoot and optimize processes on highly advanced semiconductor packaging equipment.
• Identify areas for technical improvement and gaps in performance.
• Identifies, analyzes and resolves system design weaknesses.
• Conduct machine buy-offs in K&S factory and, at times, at customer site.
• Analyze machine and process data to identify causes of process assists, failures or yield loss.
• Serve as technical interface to customers.
• Preparation of internal summary reports and customer presentations.
• Provides multi-layered technical expertise for next generation initiatives.
• Interfaces with other functional groups for troubleshooting and equipment improvement.

• At least 5 to 10 years of relevant working experience.
• Bachelor / Master / PhD in Engineering field (Mechanical, Electrical, Mechatronics) or related field.
• Strong aptitude and deep understanding of highly advanced machinery.
• Experience with flip chip, die attach or thermocompression bonding highly preferred.
• Strong data analysis skills, including working knowledge of Matlab and/or JMP, Minitab.
• Ability to travel locally and internationally about 50%, sometime more frequently.