Singapore

R&D AOI & Metrology Lead, Semiconductor Packaging, Singapore

R&D AOI & Metrology Lead, Semiconductor Packaging, Singapore
Description

STATS CHIPPAC MANAGEMENT PTE. LTD. in Singapore is looking for an R&D Engineer to develop and qualify new packaging technologies. You will lead projects related to AOI/Metrology processes and ensure the stability of processes for new products.

The ideal candidate holds a degree in Engineering and has at least 2 years of experience in the semiconductor industry, with strong knowledge of AOI/Metrology processes and skills in technical writing.

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