Senior Engineer – Process Development, Thin Films …, Singapore

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about using their expertise in the relentless pursuit of innovation for customers and partners.

The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

• Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
• Design and execute experiments, analyze data, and communicate results in appropriate technical forums.
• Perform film characterization using appropriate techniques (SEM, TEM, XPS, SIMS, AFM) and correlate results to process outcomes.
• Support process transfer and pilot line execution, including sustaining process maturity/capability for processes under ownership.
• Collaborate with multi-functional partners (Process Integration, Metrology, Surface/Characterization labs, Electrical Failure Analysis, Yield, Manufacturing, and equipment vendors/suppliers) to ensure robust processes that meet physical/electrical requirements.

• Maintain accurate documentation of experiments, process settings, and learnings; produce technical reports and summaries.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

• PhD, or Master’s 3 years, or Bachelor’s 5 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Demonstrated foundation in thin film deposition and characterization; R&D/PD environment readiness is important.

• Fundamentals of thin film deposition (CVD/Diffusion) and film characterization.
• DOE/SPC basics; ability to analyze experimental data and draw conclusions.
• Understanding of plasma/vacuum systems and process‑chemistry relationships (where applicable).

• Structured problem‑solving and learning agility in an R&D environment.
• Clear communication and cross‑functional collaboration.

• Exposure to dielectric/carbon‑based films and NAND structural/electrical requirements.
• Experience working with equipment suppliers or tool qualification/transfer activities.
• Embody Micron’s core values: People – Respect, develop and empower others; Innovation – Drive continuous improvement and breakthrough thinking; Tenacity – Show grit and determination; Collaboration – Build trust and foster teamwork; Customer Focus – Deliver excellence and value.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.