Coating Process Engineer - Semiconductors & PCB Substrates, Singapore

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Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of Coating Process Engineer to join their organization. The Job: Process Development & Optimization Develop and optimize coating processes for photoresist, and dielectric materials (e.g., PID, PI) on package substrates. Establish uniform coating parameters to ensure consistent layer thickness and adhesion. Optimize oven/thermal curing profiles for soft bake, hard bake, pre-bake, post-exposure bake (PEB), or final curing. Tool Management & Setup Define tool requirements and support installation and qualification of coaters, hot plates, and curing ovens. Maintain and troubleshoot coating and baking equipment to ensure uptime and performance. Work with equipment vendors and facilities teams on preventive maintenance and upgrades. Process Monitoring & Control Monitor coating quality, film thickness uniformity, and oven cure parameters using metrology tools (e.g., ellipsometry, thickness gauges, bake sensors). Implement process control plans, including SPC charts and run-to-run feedback control. Validate material compatibility, adhesion strength, thermal stability, and outgassing behavior. Defect Prevention & Yield Improvement Identify and resolve coating and baking-related defects. Collaborate with upstream and downstream teams to ensure integrated process stability. Documentation & Compliance Create and maintain technical documentation including SOPs, process specs, recipes, and FMEAs. Ensure all processes comply with environmental, safety, and chemical handling standards
The Talent: PhD or Master's degree in Chemical Engineering, Materials Science, Microelectronics, or a related field. 5-10+ years of experience in coating and thermal process development in substrate, PCB, or semiconductor manufacturing. Familiarity with coating materials such as photoresists, ABF, PI, solder mask, and related chemistries. Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding. Strong analytical and problem-solving skills; experience with DOE and SPC tools.
Next Steps: Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package. Apply through this application or send your resume to
***********@adecco.com
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