Principal Engineer Package Design Development, Singapore

We are seeking an experienced Principal Engineer Package Design Development to lead packages design and development for automotive products. This role provides technical leadership across cross-functional teams, drives design innovation and supports product development.
Your Role
Key responsibilities in your new role
Package Design and Development: Design and develop Flip chip BGA and Wirebond BGA Package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products. Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies. Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials. Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned. Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.
Your Profile
Qualifications And Skills To Help You Succeed
Min. Bachelor / Master's degree in Material Science, Mechanical, Electrical, Chemical Engineering / Physics or equivalents Min. 10 years of experience in package development, process development (assembly), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects for automotive products. Good technical knowledge of Back End processes & material knowledge in bumping and laminate packages and interaction with the different functions (e.g. design rules, direct materials and processes qualification). Good understanding of Automotive quality / reliability requirements and standards.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Click here for more information about Diversity & Inclusion at Infineon.