Applications Engineer – Advanced Packaging, Singapore

We are looking for an experienced Applications Engineer with strong hands-on expertise in die attach processes and advanced packaging equipment.
Key Responsibilities: Lead die attach process development and machine programming for die bonding equipment Support wire bond and vacuum reflow process development Handle sample preparation, testing, inspection, pull/shear testing, and reporting Work with advanced packaging materials including solder, epoxy, ceramics, and alloys Support customer sample builds and solve complex assembly/process challenges Develop process programs and optimize machine performance Analyze test results, troubleshoot issues, and recommend solutions Support vendor qualification and laboratory maintenance Occasionally travel within the region to support customers
Preferred Equipment Exposure: Die Bonders Wire Bonders Vacuum Reflow Systems Plasma Systems
Requirements: Bachelor's Degree or Diploma in Engineering/Science related field Minimum 5 years experience in Die Attach process/application engineering Experience in semiconductor advanced packaging or microelectronics assembly Strong understanding of packaging materials and process behavior under temperature/force conditions Hands-on machine programming and process optimization experience Strong troubleshooting, analytical, and communication skills Able to work independently with customers and internal engineering teams