Engineering WSDegree Intern – CMP Process Engineering, Singapore

About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most innovative technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries enables the technologies that transform industries and empower customers to shape their markets. Learn more at
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Role Summary
GlobalFoundries Singapore is seeking highly motivated
Engineering WSDegree Interns
to join our state-of-the-art semiconductor manufacturing facility. This role is designed to progressively develop interns from foundational semiconductor process learning to in-depth CMP process engineering exposure, culminating in a Final Year Project (FYP) aligned with real-world fab challenges.
Key Responsibilities
Block 1: Foundational Learning & Exploration
Acquire fundamental knowledge of the semiconductor industry and wafer manufacturing processes Understand the function and purpose of Chemical Mechanical Planarization (CMP) within a wafer fab Learn cleanroom protocols, safety requirements, and fab operations standards Gain exposure to quality, process, and manufacturing control methodologies Learn CMP process fundamentals, materials, consumables, and process flow Become familiar with MES, fab operations, and engineering systems Job shadow CMP Process Engineers to understand daily operations
Block 2: Process Study, Data Analysis & Troubleshooting
Deepen understanding of wafer processing and CMP process flows Learn about process parameters, configurations, and optimization techniques Perform data analysis and basic troubleshooting to improve process performance Monitor wafer quality performance using tools such as Statistical Process Control (SPC) and Fault Detection & Classification (FDC)
Block 3 & Final Year Project (FYP): EngineerinTraining Development
Work with an assigned mentor to define FYP scope, objectives, and resources Execute an FYP aligned to CMP process engineering, with increased technical depth and challenge Study process capability and collaborate with cross-functional partners to perform DOE (Design of Experiments) for CMP material evaluation and qualification Analyze data to improve process stability, defect reduction, and yield performance Participate in continuous improvement initiatives supporting cost, quality, or productivity Complete FYP under guidance of an industrial mentor
Skills & Experience Gained
Technical Skills
Hands-on experience in semiconductor manufacturing Strong understanding of wafer fabrication processes and CMP functionality Knowledge of SPC, FDC, process control systems, and metrology Independent data analysis and structured problem-solving
Soft Skills
Effective presentation and communication skills Collaboration within cross-functional and dynamic teams Exposure to AI and Machine Learning concepts and applications
Practical Experience
Work in a state-of-the-art cleanroom environment Project management experience in a cross-functional setting Networking opportunities, including management roundtables and inter-department engagement
Required Qualifications
Enrolled in a Mechanical, Chemical, Materials, Electrical, or Electronics Engineering degree Strong analytical and problem-solving skills Curious, proactive, and eager to learn Creative, innovative, and detail-oriented Strong time management and communication skills Positive mindset with strong teamwork capabilities
Additional Information
This role is exclusively for students enrolled in the WSDegree Programme (2026 intake) Internship period must be clearly stated in your CV, resume, or cover letter
Information about our benefits you can find here: