Application Engineer for Bonder and Imaging Solutions (m/f/d), Singapore

Application Engineer for Bonder (permanent bonder and TBDB tools)
Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market.
We are looking for the next possible date
Provide application support on SUSS MicroTec bonder tools. Responsible for project execution, recipe optimization, basic process training and improvement programs with the customer to effectively demonstrate the capability of new tools and/or technology. Supporting Product Specialist with defining process spec and ATP for customers. Perform final acceptance test of machines at customer site to demonstrate condition of machine and achieve final sign-off. Develop creative solutions to resolve customers' concerns and innovative solutions to cater to customer needs. Degree in Engineering/Science from a recognised university. Minimum 5 years of related work experience in Lithography wafer process engineering. Self-driven and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem solving skills, and positive attitude. Ability to work independently, be hands-on and expected to dive into technical details as required to cover thinly-resourced areas. Ability to work on a fast-paced and challenge work environment. Good interpersonal and communication skills. Travel is required > 50%
Bonus BenefitsLearing, growing and celebrating together
Year-end bonus (AWS), variable bonuses
Support in preparation for exams, permanent contacts, stays abroad or customer assignments, company events, running events