Semicon Process Engineer /Senior Engineer (SAW ,Laser groove), Singapore

• Drive quality and productivity improvement through process simplification, standardization, and robust system solutions.
• Lead continuous process improvement initiatives to meet customer requirements for quality, yield, output, and cycle time.
• Collaborate with customers and internal teams on process, material, and equipment development.
• Troubleshoot process issues and lead cross‑functional improvement activities.

• Degree in Engineering with at least 3 years of process engineering experience in the semiconductor industry.
• Knowledge of JMP, SPC, 8D, MSA, FMEA, and DOE methodologies is preferred.
• Experience in Taping, Inline Back Grind, Laser Groove, and Wafer Saw processes is an advantage.
• Independent, self‑driven, and committed team player with strong problem‑solving skills.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.