Senior ECP Copper Process Engineer (SABRE), Singapore

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

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YOUR ROLE

As aSenior Process Engineer, you will be the technical owner of theElectro‑Chemical Plating (ECP) copper processon theLAM Novellus SABRE platform. You will drive process development and sustaining activities, working closely with equipment engineering to characterize hardware, resolve complex issues, and continuously improve process robustness, yield, and overall tool performance.

• Develop, optimize, and sustainECP Cu reinforcement / damascene fill processeson Novellus SABRE tools.
• Define and tunerecipes and hardware configurationsto achieve target thickness, uniformity, fill performance, and defect levels.
• Collaborate withPVD barrier/seedand integration teams to ensure strong linkage between upstream processes (Ti, TiN, CVD‑TiN, Cu seed, etc.) and downstream ECP performance.
• Perform structuredhardware and process characterization, including experiments on flow, contact design, waveform, and chemistry conditions.
• Leadtroubleshooting and excursion management, conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions.

YOUR SKILLS & EXPERIENCES

• Bachelor’s or Master’s degree inElectrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering, or a related discipline.
• Min 5 years of hands‑on experiencewithECP copper processes on LAM Novellus SABRE systemsin a semiconductor fab environment.
• Solid knowledge ofsemiconductor manufacturing,vacuum technology, andthin‑film deposition, including PVD barrier/seed fundamentals.
• Strongcollaboration and communicationskills: able to document and present findings clearly through technical reports, reviews, and data summaries; active participation in cross‑functional forums and project teams.
• Provenproblem‑solving capability, including advanced root‑cause analysis, failure‑mode identification, and implementation of robust, sustainable solutions.