Senior Engineer, Operations Engineering (Die Attach/Wire …, Singapore

Adecco is partnering with a global leader in semiconductor packaging and electronic assembly solutions to fill a senior engineer position in their DA/FC Line.

• To perform qualification on semiconductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment.
• Identify, diagnose and resolve assembly process-related problems to achieve defined first pass yield and manufacturing cycle-time.
• Develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) for manufacturing usage.
• Recommend enhancements to process recipes, process tooling or manufacturing processes to ensure excellent manufacturing process coverage of semiconductor packaging equipment to their bonding functionalities.
• Establish PFMEA process testing for customized kits to ensure machine is performing to customer's requirements.
• Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.
• Setup and real‑time monitoring of critical manufacturing processes with abnormally detection criteria and/or SPC.
• Training and skillset profiling of assembly technicians.
• Perform other duties as assigned.

• Degree in Engineering (Materials Science, Electrical or Mechanical) with 5 years of related experience.
• Possess strong statistical analysis skillset with demonstrated ability to conduct design‑of‑experiment (proficient in JMP or Minitab).
• Excellent systematic problem solving in areas of containment and countermeasures.
• Experience in process development of bonding processes (Wiring Bonding, Die‑Bonding, Thermocompression Bonding or Flip Chip) is needed.
• Knowledge of coding (Matlab, Python) will be advantageous.
• Ability to adjust to shift work as needed during manufacturing volume demand. Typical working hours are 8:30 am to 5:30 pm; subject to conference calls in Eastern US timing on a per‑need basis.