Engineer, Advanced Packaging Process and Equipment …, Singapore

We are looking for an Advanced Packaging Process and Equipment Technology Engineer to join our Advanced Packaging Technology Development (APTD) team. Your responsibilities include developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements. You will collaborate with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows.

• Develop and optimize assembly processes for advanced packaging technologies, including wafer‑level packaging and die stacking (Chip on Wafer, Chip to Wafer).
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Establish and improve process management projects to deliver technology node requirements.

• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for a variety of semiconductor equipment.
• Evaluate, promote, and plan for new equipment and materials.

• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
• Collaborate with teams such as Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate manufacturing processes for optimal performance and quality control.
• Ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Provide Process of Record (POR) and Model of Record (MOR) documentation for product transfer to high volume manufacturing facilities.

• B.S./M.S./Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.
• Experience in semiconductor process and equipment is advantageous.
• Strong understanding of process flows, interactions, and how changes affect yield, performance, and reliability.
• Experience with Design of Experiments (DOE), Statistical Process Control (SPC), defect analysis, and data analysis.
• Tenacity to work effectively under timelines and limited resources.
• Consistent track record of solving problems and addressing root causes.
• Good communication skills.
• Interest in the semiconductor industry.
• Showcases leadership potential.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact .